06
2023
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12
Application of Nano-Silica in Electronic Packaging Materials
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Industry News
High-purity spherical nano-SiO2 as a new type of scarce mineral materials, because of its high dielectric, high heat resistance, high moisture resistance, high filling volume, low expansion, low stress, low impurities, low friction coefficient and other superior performance, in the electronics, electrical appliances and many other fields has broad application prospects, is the main raw materials necessary for large-scale integrated circuit packaging. At present, most electronic packaging materials at home and abroad are high polymers, among which epoxy resin filled with 70% to 90% high-purity spherical nano-silica powder is used. The high water absorption and viscosity of epoxy resin limits its application in large-scale integrated circuits, and a large amount of silica micropowder can be added to epoxy resin, which can reduce the thermal expansion coefficient, water absorption, internal stress, shrinkage and improve the thermal conductivity of the molding compound.
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